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AN1499 APPLICATION NOTE
DESIGNING A LOW COST POWER BOARD FOR THE ST92141 MOTOR CONTROL MCU WITHOUT USING IPMs
By Motor Control Competence Center
INTRODUCTION
Power Modules have been in use for twenty years in industrial motor drive applications. For power stage designs, they give the advantages of compactness and good thermal behavior. Over the last few years a new family of Power Modules, called Intelligent Power Modules (IPM), have tried to take the integration of motor drive power stages a step further. These IPMs target lower power and lower cost motor drive systems compared to those targeted by standard Power Modules. However it is an open question whether these IPMs suit high volume and very cost-sensitive applications, such as the household appliance market. Figure 1. General System View
AN1499/0202
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Table of Contents
INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 INTELLIGENT POWER MODULES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 ADVANTAGES OF IPMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1.1 1.1.2 1.1.3 1.1.4 1.1.5 1.1.6 Assembly cost . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Component count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reduction in time to market . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Higher reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Product compactness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 4 4 4
1.2 DRAWBACKS OF IPMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.2.1 1.2.2 1.2.3 1.2.4 1.2.5 Lead frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Heatsink planarity and stiffness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Embedded gate drive & filter cost . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External bootstrap diodes and temperature protection needed . . . . . . . . . . . . . . . . . Component choice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 5 5 5
2 AN ALTERNATIVE SOLUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 ADVANTAGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.1 2.1.2 2.1.3 2.1.4 2.1.5 Assembly & mounting considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reduction in time to market . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reliability considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gate drive optimization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 7 7 7
2.2 DRAWBACKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2.1 Component count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2.2 PCB connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 CONCLUSION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 MECHANICAL DATA: ST92141-PLATFORM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 CONTROL BOARD LAYOUT (ORCAD FILES AVAILABLE) . . . . . . . . . . . . . . . . . . 20
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1 INTELLIGENT POWER MODULES
These products integrate in a single transfer molded package, six IGBTs, six free wheeling diodes and the interfacing circuits needed to enable direct control from a microcontroller. In their low cost version they do not include the front-end rectification diodes, nor do they have a switch or diode for active power factor correction. External circuits are still needed, such as bootstrap supplies, current sensing and filtering, and auxiliary supply decoupling. This application note analyzes the advantages and drawbacks of this power integration approach with regard to the constraints of cost sensitive motor drives. An alternative solution is proposed that fits better to appliance and large volume applications in term of optimization and cost. 1.1 ADVANTAGES OF IPMS Out of all the advantages that are claimed, the major ones seem to be the following: - Less assembly cost - Lower component count - Reduction in time to market - Higher reliability - Product compactness - Low inductance package These are general claims that need to be confronted with reality. 1.1.1 Assembly cost Assembling an IPM requires placing it on the PCB, wave soldering and later on fixing the heatsink with screws. These operations are indeed less expensive than assembling six discrete components. You should note however that if an active power factor corrector is needed, external discrete power components are required. 1.1.2 Component count This is a clear advantage because nine components are replaced by each IPM. However the need for microcontroller and passive component assembly remains and IPMs do not remove any major manufacturing step. 1.1.3 Reduction in time to market Layout of IGBT and MOSFET gate drives requires special expertise. Using an IPM does not require all this expertise, but a good understanding of EMI and parasitic inductance effects is still strongly recommended!
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Assuming this expertise is available, the estimated saving will be hardly be more than the time it takes to have a coffee break! 1.1.4 Higher reliability From a silicon point of view, there are still about 15 dice inside the module with their own MTBFs related to junction temperature as well as more than 40 wire bonds. So the system MTBF may increase because the connection and assembly count decreases. However it may decrease if the heatsink is not perfectly flat below the whole IPM surface. 1.1.5 Product compactness When just comparing power switches, IPMs bring compactness. But when talking about the whole system, the difference is negligible. Passive components, heatsink, PCB and connectors are by far the most bulky parts. 1.1.6 Package inductance The only circuit area where IPMs reduce the parasitic inductance is located between the gate drivers and the power switches. This is true for the high side gate drivers but not for the low side drivers. Figure 2 shows that during turn-on, the low side gate drive current loop (B) is not internal to the module but goes outside. In this case, IPMs do not have a significant advantage over discrete solutions. Figure 2. Low side gate drive current loop
Half Bridge driver Vcc
B
A
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1.2 DRAWBACKS OF IPMS Counterbalancing the advantages listed above, IPMs have major drawbacks that make their use in cost sensitive applications rather questionable. Let's review these drawbacks: 1.2.1 Lead frame Due to manufacturing constraints, an IPM has leads on both sides of the package. This means that the PCB must be installed parallel to the package. So the heatsink must have its contact base parallel to the IPM and the PCB. When you are looking for a very cheap solution, this makes the choice of heatsink difficult. 1.2.2 Heatsink planarity and stiffness Inside the IPM, power switches are soldered directly on a long and thin lead frame. Then this lead frame is fully molded for isolation between the heatsink and the active parts. As a result, these IPMs have a low stiffness and need to be assembled on a good quality heatsink to avoid internal cracks. As a consequence, cheap heatsinks made of metal sheet are not recommended. This may lead to additional cost. 1.2.3 Embedded gate drive & filter cost One sensitive parameter, in terms of optimizing the motor drive cost, is gate drive impedance. By adjusting this impedance properly, you can find the right compromise between filter cost and heatsink cost. As IPMs do not give access to the gate drive impedance, you cannot adjust the dV/dt commutation which may lead to additional filter cost. 1.2.4 External bootstrap diodes and temperature protection needed Most IPMs available today do not have over-temperature protection. This requires additional external circuits. As bootstrap diodes are not integrated in the module, they need to be added externally. This leads to additional cost. 1.2.5 Component choice Needless to say the choice of IPMs today is very scarce and does not match the broad range of power switch and interface circuits. This is a real drawback when cost is all-important.
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2 AN ALTERNATIVE SOLUTION
The basic idea behind the IPM solution consists of reducing the component count, simplifying assembly and making board layout easier. However it has been shown that the cost benefit is not always easy to determine when you calculate at system level. Another way to split the system consists of grouping all the system SMD components on a small size FR4 board, called the Control Board, and keeping all the power switches and discrete components on a mother board called the Power Board. Figure 5, Figure 6 & Figure 7 show an AC motor drive application using this partitioning. An example layout and parts list are given in Appendix 2. It is worthwhile to review the advantages and drawbacks of this new partitioning. 2.1 ADVANTAGES 2.1.1 Assembly & mounting considerations Figure 6 shows a control board schematic implementing a microcontroller, its peripheral circuits and three High Voltage Integrated Circuits for interfacing directly to the Power Board schematic shown in Figure 7. This microcontroller is dedicated to AC motor control and is housed in a shrink SO34 package (refer to the parts list in Appendix 2 and ST92141 and L6386 datasheet on http:\\www.st.com). The size of this type of control board is about 26mm by 87mm. This makes use of available FR4 hardware . This board can be plugged into the Power Board next to the discrete power switches. The Power Board layout is very easy and simple, even if low cost materials like CEM1 are used. This makes the size of the Power Board smaller even if single side copper is used. The total volume of the Control Board and the power switches is very compact. Moreover, the discrete Power switches can fit many different heatsink configurations, parallel or perpendicular, with no planarity and stiffness constraints. Another advantage comes from the soldering process differentiation: SMD components are soldered using a reflow process, discrete components go through solder waves. This improves the production yield. Finally, if an active power factor is needed, it is easy to add another switch to the power stage. 2.1.2 Reduction in time to market The physical split between control circuits and power parts make the system easy to layout and quick to debug. The system power range or the input front end can be adapted without affecting the Control Board and vice versa. Any change of microcontroller package or its peripheral circuits does not interfere with the power stage.
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In other words, the same Control Board can fit different Power Boards. This makes the first design shorter and the future re-design even faster. 2.1.3 Reliability considerations The reflow process used to solder the Control Board is proven to be more reliable than the wave process. The connection between both boards is done during the wave process. Figure 5 shows a typical implementation and Appendix 1 gives the results of the vibration test performed on this assembly. 2.1.4 Thermal management Assembling the discrete components by clips enables the dissipation to be spread over the whole heatsink surface. This avoids concentrating the losses on a small area and allows you to use cheap heatsink technology made of metal sheet. 2.1.5 Gate drive optimization Figure 8 shows the influence of the gate drive impedance on the conducted noise. As the whole gate drive is available on the Control Board, it is easy to adapt the noise level according to the filter attenuation at any time. This noise level optimization can save time and cost. Moreover the Control Board design allows the use of advanced High Voltage Integrated Circuits that integrate a bootstrap diode and comparators (refer to L6386 on http:\\www.st.com). The is true for power switch selection (see the fully insulated TO220 products like STGP7NB60HDFP on http:\\www.st.com). 2.2 DRAWBACKS The main drawbacks relate to: 2.2.1 Component count Compared to the IPM solution, both the Control Board and the Power Board each implement about six components more. 2.2.2 PCB connections The double sided Control Board soldering totals 68 contacts that are processed during wave soldering.
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3 CONCLUSION
This comparison between two different system partitioning methods has shown that the Intelligent Module approach is not the most flexible and cheap solution when designing cost sensitive motor control applications. The alternative solution that is presented gives several advantages that are decisive when cost is the overriding factor: - Access to low cost heatsink technology and better thermal management - Use of different processes for SMD and through-hole components to improve the production yield - Fexibility to adapt the Power Board with no impact on the Control Board and vice versa - Access to gate drive impedance to optimize the EMI level at any time - Choice of a large portfolio of interface ICs and power switches For further details about the Control Board hardware and software features, refer to AN1498. Figure 3. Control Board high voltage interfacing side
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Figure 4. Control Board microcontroller side
Figure 5. Control Board plugged into the Power Board next to the discrete parts
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Figure 6. Typical Control Board circuit for AC motor control applications
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Figure 7. Typical Power Board circuit for AC motor control applications
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Figure 8. Conducted noise depending on gate drive impedance On the left: Rg = 220R on the right: Rg = 82R
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APPENDIX 1: Vibration test results of Control Board and Power Board assembly
VIBRATIONS, SINUSOIDAL (Stantard: IEC 68-2-6, test Fc) Electrical limits were tested on two modules after a Vibrations, sinusoidal as below specified: Puma Sine Test Synopsis Test Results: Reason For Shutdown: Normal Test Completion Elasped Test Time: 0002:052:054 Elasped Sweeps: 20.00 Remaining Sweeps: 0.00 Points Per Sweep: 800 Test Range: 5.00(Hz) to 2000.00(Hz) Control Parameters Control Strategy: Average Filter Type: Proportional Filter Specification: 80.00% Sweep Mode: LOG Sweep Rate: 1.00 (Oct/Min) Shaker Limits Acceleration: 45.0000 Velocity: 59.0551 Displacement: 0.9843 Velocity: 12.0000 Symetric Limits: Yes Resonance Search And Dwell Setup Max Resonances: 10 Hysteresis: 3 Minimum Q Value: 1.00 Smoothing: Low Channel Number: Control Profile Settings Status Frequency Type #00 #01 #02 On On On 5.0 57.6 2000.0 Acceleration Velocity Displacement Displacement 0.0755 Displacement 10.0001 Acceleration 10.0000 Lo Alarm 0.023562 1.500000 3.0 0.271203 1.500000 3.0 0.007804 0.001242 3.0 Hi Lo Hi Alarm Abort Abort 3.0 6.0 6.0 3.0 6.0 6.0 3.0 6.0 6.0
Sample N. 1 2
Visual Inspection Passed Passed
Electrical Test At 25 C (Before and after test) Passed Passed
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Figure 9. Sinusoidal profile
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ANNEX 2: Control Board parts list Bill Of Materials
Item Quantity 1 6
October 17,2001
Reference C1 C8 C22 C40 C41 C42 C2 C3 C33 C39 C46 C4 C7 C9 C18 C30 C37 C5 C19 C34 C6 C20 C35 C36 C45 C10 C11 C12 C13 C23 C24 C25 C26 C27 C28 C29 C14 C15 C21 C32 Value 470nF 470nF 470nF 470nF 470nF 470nF 100nF 100nF 100nF 100nF 100nF 100pF 100pF 100pF 100pF 100pF 100pF 470nF 470nF 470nF 1nF 1nF 1nF 1nF 1nF 10nF 10nF 10nF 10nF 10nF 10nF 10nF 10nF 10nF 10nF 10nF 47pF 470nF 470nF 470nF
11:46:37Page1
Voltage 16V 16V 16V 16V 16V 16V % Footprint X7R X7R X7R X7R X7R X7R Y5V Y5V Y5V Y5V Y5V 0805 0805 0805 0805 0805 0805 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0805 0805 0805 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0805 0805 0805
2
5
3
6
4
3
25V 25V 25V
Y5V Y5V Y5V
5
5
6
11
7 8
1 3
63V 63V 63V 63V 63V 63V 63V 63V 63V 63V 63V 63V Y5V Y5V Y5V
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Item Quantity 9 3
Reference C16 C31 C43 C17 C38 C44 D1 D2 D3 D20 D21 D22 D23 D24 D25 D26 IC1 IC2 IC4 IC3 U1 IC5 Q1 Q2 Q3 Q4 Q5 Q6 Q7 R1 R2 R4 R17 R3 R15 R24 R36 R46 R81 R82 R83 R84 R85
Value 10nF 10nF 10nF 2.2nF 1uF 1uF BAS16 BAS16 BAS16 BAS16 BAS16 BAS16 BAS16 BAS16 BAS16 BAS16 L6386D L6386D L6386D ST92T141K4M6 LM358D LM358D BC807-25 BC807-25 BC807-25 BC807-25 BC807-25 BC807-25 BC817-25 10K 10K 10K 10K 82R 82R 82R 82R 82R 82R 82R 82R 82R 82R
Voltage
%
Footprint 0603 0603 0603 0603 0805 0805 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SO-14 SO-14 SO-14
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20 21
1 4
22
12
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DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...
Item Quantity 23 7
Reference R86 R5 R8 R16 R25 R37 R45 R47 R6 R9 R10 R11 R12 R13 R14 R19 R20 R21 R22 R23 R28 R29 R30 R31 R32 R33 R35 R38 R39 R40 R41 R42 R43 R44 R50 R27 R18 R26 R48 R49 R51 R52 R53
Value 82R 220R 220R 220R 220R 220R 220R 220R 100R 0R 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 100K 1K 1K 2.7K 820R 1M 4.7K 33.2K 750R
Voltage
%
Footprint 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603
24 25 26
1 1 26
27 28 29 30 31 32 33
2 1 1 1 1 1 1
1% 1% 1% 1%
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DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...
Item Quantity 34 35 36 37 38 1 2 1 1 6
Reference R54 R56 R55 R63 R80 TP1 TP2 TP3 TP4 TP5 TP6 TP8 TP7 U2 XT1
Value 47K 1.5K 1.5K 390R 6.8K TPshort TPshort TPshort TPshort TPshort TPshort TP0 TP0 M95040 CSTCC-MG
Voltage
% 1% 1% 1%
Footprint 0603 0603 0603 0603 0603 PAD PAD PAD PAD PAD PAD PAD PAD SO-8 (XT_CSTCCMG)
39 40 41
2 1 1
5MHz
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DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...
4 MECHANICAL DATA: ST92141-PLATFORM
Figure 10. Mechanical Data
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DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...
5 CONTROL BOARD LAYOUT (ORCAD FILES AVAILABLE)
Figure 11. Microcontroller side
XT1
TP6 TP5 TP4 TP3 T P2 TP1
C21
C32
R17
C15
IC3 R2 R12
R13 R11 R10 R34 R33 R32 R31 R30 R29 R28 R14
C41
C42
ST92141-ENG3
Q7
R6
TP8 C 33 R45 U1
C2 R1
R21
R22
R20
R19
R44
R43
R42
R41
R40
R39
R82
R83
R84
R85
D2 D24 D1
C12
C13
C10 C29
C28
C27
C26
C25 C24
C23
C11
R4
C14
C3
D3
Figure 12. High voltage interfacing side
TP7 C34 C43 R80 C19 R18 R48 C36 C35 C17 R26 C20 C5 C16 R9
C38 R49
R50
1
D21
D 22
D23
R54
R38
R23
C31
R35
D26
C44 R56
ST92141-ENG3
D25
C46 U2 C39
C6
R63
R51 R46 R86 R47 Q6
R27
C22
C8
C1
IC4
IC2 R25
IC1 R7 R8 R3 R5
R37 Q5
R16
C30
R24
C18
R36 C37
R15
C9
C7
C4
Q4
Q3
Q2
Q1
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DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...
"THE PRESENT NOTE WHICH IS FOR GUIDANCE ONLY AIMS AT PROVIDING CUSTOMERS WITH INFORMATION REGARDING THEIR PRODUCTS IN ORDER FOR THEM TO SAVE TIME. AS A RESULT, STMICROELECTRONICS SHALL NOT BE HELD LIABLE FOR ANY DIRECT, INDIRECT OR CONSEQUENTIAL DAMAGES WITH RESPECT TO ANY CLAIMS ARISING FROM THE CONTENT OF SUCH A NOTE AND/OR THE USE MADE BY CUSTOMERS OF THE INFORMATION CONTAINED HEREIN IN CONNEXION WITH THEIR PRODUCTS."
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